File:Hard rev lim board 1.1.0 solder applied.jpg: Difference between revisions

Latest revision as of 07:07, 8 October 2007

solder applied to pads

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	Date/Time	Thumbnail	Dimensions	User	Comment
current	07:07, 8 October 2007		800 × 600 (99 KB)	Brentp (talk \| contribs)	solder applied to pads

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Camera manufacturer	Canon
Camera model	Canon PowerShot SD300
Exposure time	1/60 sec (0.016666666666667)
F Number	f/5.6
Date and time of data generation	12:43, 7 October 2007
Lens focal length	5.8 mm
Orientation	Normal
Horizontal resolution	180 dpi
Vertical resolution	180 dpi
File change date and time	12:43, 7 October 2007
Y and C positioning	Centered
Exif version	2.2
Date and time of digitizing	12:43, 7 October 2007
Image compression mode	3
APEX shutter speed	5.90625
APEX aperture	4.96875
Maximum land aperture	2.96875 APEX (f/2.8)
Metering mode	Center weighted average
Flash	Flash fired, compulsory flash firing
Color space	sRGB
Focal plane X resolution	10,142.857142857
Focal plane Y resolution	10,142.857142857
Focal plane resolution unit	inches
Sensing method	One-chip color area sensor
Custom image processing	Normal process
Exposure mode	Manual exposure
White balance	Manual white balance
Digital zoom ratio	1
Scene capture type	Standard

Revision as of 07:07, 8 October 2007 (view source) Brentp (talk \| contribs) (solder applied to pads)	Latest revision as of 07:07, 8 October 2007 (view source) Brentp (talk \| contribs) m (Protected "Image:Hard rev lim board 1.1.0 solder applied.jpg": obvious [edit=sysop:move=sysop])
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